Chemraz® O-Rings Supplier FFKM Semiconductor O-Ring and High Temperature Seals Experts
Contact a Semiconductor Application Engineer
Compound Name | Features and Benefits | Service Temp Range (C) | Wet vs. Dry | Static vs. Dynamic | Primary Choices for Processes (Bold) | Applications |
Chemraz 513 | Good plasma resistance Good physical properties Minimal contamination Excellent performance history as "universal product" | -30 to 210ºC | Dry | Static | Metalization (CVD, PVD, sputtering, evaporation) | Door Seals, Slit Valves, Window Seals, Isolator Valve Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals |
Chemraz 520 | Excellent plasma resistance Outstanding physical properties Low contaminants Withstands higher sealing loads Excellent performance history in higher temperature applications | -30 to 240ºC | Dry | Static and Dynamic | Metalization (CVD, PVD, sputtering, evaporation) | Door Seals, Slit Valves, Window Seals, Isolator Valve Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals |
Chemraz 550 | Good chemical resistance Good physical properties Used where contamination requirements are less critical Excellent performance history | -30 to 210ºC | Wet | Static and Dynamic | Wet Etch (acid, base) Wet Stripping (solvents) Wet Cleaning (UPDI) Wet Metal Plating | Valve Seals, Fitting and Union Seals, Gaskets, Regulator Seals, Filter Seals |
Chemraz 570 Chemraz 571 | Very low contaminants Extended performance and added reliability Good physical properties Excellent performance history in wet systems | -30 to 210ºC | Wet | Static | Wet Etch (acid, base) Wet Stripping (solvents) Wet Cleaning (UPDI) Wet Metal Plating Chemical Mechanical Planarization (CMP) | Valve Seals, Fitting and Union Seals, Gaskets, Regulator Seals, Filter Seals |
Chemraz 592 | Excellent physical properties Inert filler system ensures excellent resistance to plasma attack | -30 to 240ºC | Dry | Static and Dynamic | Dry Ashing (O 2 ) Oxidation (LPCVD) Diffusion Metalization (CVD, PVD, sputtering, evaporation) Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD) Dry Plasma Etch Remote Plasma Cleans Ion Implant Implant Anneal RTP | Slit Valves, Endpoint Windows, Window Seals, Valve Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals, Isolator Valve Seals, Bell Jar Seals |
Chemraz 653 | Excellent plasma resistance Used where contamination requirements are less critical Suitable for higher temperature applications Superior compression set | -15 to 325ºC | Dry | Static and Dynamic | Oxidation (LPCVD) Diffusion RTP Metalization (CVD, PVD, sputtering, evaporation) Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD) Dry Plasma Etch Remote Plasma Cleans Dry Ashing Implant Anneal | Quartz Rod Seals, Bell Jar Seals, High Temperature Valve Seals, KF Fitting Seals |
Chemraz E38 | Minimal contamination Withstands a variety of aggressive chemicals Excellent physical properties Low metal ion content Unlimited design flexibility Suitable for higher temperature applications | -20 to 260ºC | Dry | Static and Dynamic | Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD) Remote Plasma Cleans Oxidation (LPCVD) Diffusion Metalization (CVD, PVD, sputtering, evaporation) Dry Plasma Etch Dry Ashing Ion Implant Implant Anneal RTP | Bonded Gate Seals, Chamber Seals |
Chemraz 661 | Minimal particulation Maximum plasma resistance Withstands a variety of aggressive chemicals Excellent physical properties Unique filler system | -20 to 240ºC | Dry | Static and Dynamic | Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD) Dry Plasma Etch Remote Plasma Cleans Dry Ashing Oxidation (LPCVD) Diffusion Metalization (CVD, PVD, sputtering, evaporation) Ion Implant Implant Anneal RTP | Endpoint Windows, Bell Jar Seals, Valve Seals, KF Fitting Seals, Window Seals, Isolator Valve Seals, Lid Seals, Gas Inlet Seals, Slit Valve Seals, Chamber Seals |
Fluoro- elastomer 742 | Outstanding physical properties Conforms well to handware features Used where contamination requirements are less critical Good performance history in chemically aggressive systems | -30 to 250ºC | Dry and Wet | Static and Dynamic | Metalization (CVD, PVD, sputtering, evaporation) Ion Implant Oxidation (LPCVD) Diffusion Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD) Dry Plasma Etch Remote Plasma Cleans Dry Ashing Wet Etch (acid, base) Wet Cleaning (UPDI) Wet Metal Plating Implant Anneal RTP | Door Seals, Slit Valves, Window Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals, Valve Seals, Gaskets, Fitting and Union Seals |
Fluoro- elastomer 931 | Outstanding physical properties Used where contamination requirements are less critical Superior performance under higher sealing loads Good performance history in chemically aggressive systems | -30 to 250ºC | Dry and Wet | Static and Dynamic | Ion Implant Oxidation (LPCVD) Diffusion Metalization (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD) Dry Plasma Etch Remote Plasma Cleans Dry Ashing Wet Etch (acid, base) Wet Cleaning (UPDI) Wet Metal Plating Implant Anneal RTP | Door Seals, Slit Valves, Window Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals, Valve Seals, Gaskets, Fitting and Union Seals |
Fluoraz 888 | Outstanding physical properties Good performance history in aggressive chemicals Conforms well to hardware features | 0 to 230ºC | Dry and Wet | Static and Dynamic | Metalization (CVD, PVD, sputtering, evaporation) Dry Plasma Etch Ion Implant Oxidation (LPCVD) Diffusion Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD) Remote Plasma Cleans Dry Ashing Implant Anneal RTP | Valve Seals, KF Fitting Seals, Window Seals, Lid Seals, Gas Inlet Seals, Chamber Seals, Door Seals, Gaskets, Fitting and Union Seals, Slit Valves |
Chemraz Compound Property Comparison Contact a Semiconductor Application Engineer
|
* 70 hours @ 204ºC @ 25% deflection
** 70 hours @ 288ºC @ 25% deflection
Product Handling, Cleaning and Packaging Designators
The handling, cleaning and packaging of elastomeric seals, for use in semiconductor equipment, can be as critical to the performance of the seal as the seal material. One of the following designators is included in each Greene, Tweed part number.
SD Semiconductor grade product with special handling using gloves during processing. Product is washed with deionized water (DI) and inspected to semiconductor standards. Class 100 packaging in double plastic bags.
SS Semiconductor grade product with special handling using gloves during processing. Product is washed with a solvent mixture (50/50 isopropyl alcohol and heptane) and inspected
to semiconductor standards. Class 100 packaging in double plastic bags.SP Industrial grade product without special handling during processing. Product is washed with isopropyl alcohol and is inspected to industrial standards. Standard packaging in single plastic bags.
SC Semiconductor grade product with special handling using gloves during processing. Product is inspected to semiconductor standards. Standard packaging in single plastic bags.
Statements and recommendations in this publication are based on our experience and knowledge of typical applications of this product and shall not constitute a guarantee of performance nor a modification or alteration of our standard warranty which shall be applicable to such products.
Prior to actual use it is recommended compatibility tests be run to determine suitability in a specific application. This is critical where failure could result in injury or damage. A regular program of inspection and replacement should be implemented. Greene, Tweed technical personnel are available to help with a recommendation.