Chemraz® O-Rings

High Performance O-Rings for the Semiconductor Industry and High Temperature Applications.

Compound #
Features and Benefits
Service Temp Range (C)
Wet vs Dry
Static vs Dynamic
Primary Choices for Processes (Bold)
Applications
Chemraz 513
  • Good plasma resistanceGood physical properties.
  • Minimal contamination.
  • Excellent performance history as 'universal product'.
-30 to 210ºC
Dry
Static
  • Metalization (CVD, PVD, sputtering, evaporation)
  • Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
  • Dry Plasma Etch
  • Remote Plasma Cleans
  • Dry Ashing
  • Ion Implant
  • Implant Anneal RTP
  • Door Seals
  • Slit Valves
  • Window Seals
  • Isolator Valve Seals
  • Lid Seals
  • Gas Inlet Seals
  • KF Fitting Seals
Chemraz 520
  • Excellent plasma resistance.
  • Outstanding physical properties.
  • Low contaminants.
  • Withstands higher sealing loads.
  • Excellent performance history in higher temperature applications.
-30 to 240ºC
Dry
Static and Dynamic
  • Metalization (CVD, PVD, sputtering, evaporation)
  • Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
  • Dry Plasma Etch
  • Remote Plasma Cleans
  • Dry Ashing
  • Oxidation (LPCVD)
  • Diffusion
  • Ion Implant
  • Implant Anneal RTP
  • Door Seals
  • Slit Valves
  • Window Seals
  • Isolator Valve Seals
  • Lid Seals
  • Gas Inlet Seals
  • KF Fitting Seals
Chemraz 550
  • Good chemical resistance.
  • Good physical properties.
  • Used where contamination requirements are less critical.
  • Excellent performance history.
-30 to 210ºC
Wet
Static and Dynamic
  • Wet Etch (acid, base)
  • Wet Stripping (solvents)
  • Wet Cleaning (UPDI)
  • Wet Metal Plating
  • Valve Seals
  • Fitting and Union Seals
  • Gaskets
  • Regulator Seals
  • Filter Seals
Chemraz 570 Chemraz 571
  • Very low contaminants.
  • Extended performance and added reliability.
  • Good physical properties.
  • Excellent performance history in wet systems.
-30 to 210ºC
Wet
Static
  • Wet Etch (acid, base)
  • Wet Stripping (solvents)
  • Wet Cleaning (UPDI)
  • Wet Metal Plating
  • Chemical Mechanical
  • Planarization (CMP)
  • Valve Seals
  • Fitting and Union Seals
  • Gaskets
  • Regulator Seals
  • Filter Seals
Chemraz 592
  • Excellent physical properties.
  • Inert filler system ensures excellent resistance to plasma attack.
-30 to 240ºC
Dry
Static and Dynamic
  • Dry Ashing (O 2)
  • Oxidation (LPCVD)
  • Diffusion
  • Metalization (CVD, PVD, sputtering, evaporation)
  • Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
  • Dry Plasma Etch
  • Remote Plasma Cleans
  • Ion Implant
  • Implant Anneal
  • RTP
  • Slit Valves
  • Endpoint Windows
  • Window Seals
  • Valve Seals
  • Lid Seals
  • Gas Inlet Seals
  • KF Fitting Seals
  • Isolator Valve Seals
  • Bell Jar Seals
Chemraz 653
  • Excellent plasma resistance.
  • Used where contamination requirements are less critical.
  • Suitable for higher temperature applications.
  • Superior compression set.
-15 to 325ºC
Dry
Static and Dynamic
  • Oxidation (LPCVD)
  • Diffusion RTP
  • Metalization (CVD, PVD, sputtering, evaporation)
  • Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
  • Dry Plasma Etch
  • Remote Plasma Cleans
  • Dry Ashing
  • Implant Anneal
  • Quartz Rod Seals
  • Bell Jar Seals
  • High Temperature Valve Seals
  • KF Fitting Seals
Chemraz E38
  • Minimal contamination.
  • Withstands a variety of aggressive chemicals.
  • Excellent physical properties.
  • Low metal ion content.
  • Unlimited design flexibility.
  • Suitable for higher temperature applications.
-20 to 260ºC
Dry
Static and Dynamic
  • Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
  • Remote Plasma Cleans
  • Oxidation (LPCVD)
  • Diffusion Metalization (CVD, PVD, sputtering, evaporation)
  • Dry Plasma Etch
  • Dry Ashing
  • Ion Implant
  • Implant Anneal
  • RTP
  • Bonded Gate Seals
  • Chamber Seals
Chemraz 661
  • Minimal particulation.
  • Maximum plasma resistance.
  • Withstands a variety of aggressive chemicals.
  • Excellent physical properties.
  • Unique filler system.
-20 to 240ºC
Dry
Static and Dynamic
  • Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
  • Dry Plasma Etch
  • Remote Plasma Cleans
  • Dry Ashing
  • Oxidation (LPCVD)
  • Diffusion
  • Metalization (CVD, PVD, sputtering, evaporation)
  • Ion Implant
  • Implant Anneal
  • RTP
  • Endpoint Windows
  • Bell Jar Seals
  • Valve Seals
  • KF Fitting Seals
  • Window Seals
  • Isolator Valve Seals
  • Lid Seals
  • Gas Inlet Seals
  • Slit Valve Seals
  • Chamber Seals
Fluoro- elastomer 742
  • Outstanding physical properties.
  • Conforms well to handware features.
  • Used where contamination requirements are less critical.
  • Good performance history in chemically aggressive systems.
-30 to 250ºC
Dry and Wet
Static and Dynamic
  • Metalization (CVD, PVD, sputtering, evaporation)
  • Ion Implant
  • Oxidation (LPCVD)
  • Diffusion
  • Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
  • Dry Plasma Etch
  • Remote Plasma Cleans
  • Dry Ashing
  • Wet Etch (acid, base)
  • Wet Cleaning (UPDI)
  • Wet Metal Plating
  • Implant Anneal
  • RTP
  • Door Seals
  • Slit Valves
  • Window Seals
  • Lid Seals
  • Gas Inlet Seals
  • KF Fitting Seals
  • Valve Seals
  • Gaskets
  • Fitting and Union Seals
Fluoro- elastomer 931
  • Outstanding physical properties.
  • Used where contamination requirements are less critical.
  • Superior performance under higher sealing loads.
  • Good performance history in chemically aggressive systems.
-30 to 250ºC
Dry and Wet
Static and Dynamic
  • Ion Implant
  • Oxidation (LPCVD)
  • Diffusion Metalization (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
  • Dry Plasma Etch
  • Remote Plasma Cleans
  • Dry Ashing
  • Wet Etch (acid, base)
  • Wet Cleaning (UPDI)
  • Wet Metal Plating
  • Implant Anneal
  • RTP
  • Door Seals
  • Slit Valves
  • Window Seals
  • Lid Seals
  • Gas Inlet Seals
  • KF Fitting Seals
  • Valve Seals
  • Gaskets
  • Fitting and Union Seals
Fluoraz 888
  • Outstanding physical properties.
  • Good performance history in aggressive chemicals.
  • Conforms well to hardware features.
0 to 230ºC
Dry and Wet
Static and Dynamic
  • Metalization (CVD, PVD, sputtering, evaporation)
  • Dry Plasma Etch
  • Ion Implant
  • Oxidation (LPCVD)
  • Diffusion Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
  • Remote Plasma Cleans
  • Dry Ashing
  • Implant Anneal
  • RTP
  • Valve Seals
  • KF Fitting Seals
  • Window Seals
  • Lid Seals
  • Gas Inlet Seals
  • Chamber Seals
  • Door Seals
  • Gaskets
  • Fitting and Union Seals
  • Slit Valves

The information on this page is to the best of our knowledge accurate and reliable. However, Marco Rubber makes no warranty, expressed or implied, that parts manufactured from this material will perform satisfactorily in the customer's application. It's the customer's responsibility to evaluate parts prior to use.

The temperature ranges presented on this page are approximations for dry air service only and should not be used to determine design specifications or end-use temperature limits. Actual temperature range of a compound in an end-use application is highly dependent on part type, hardware configuration, applied forces, chemical media, pressure and thermal cycling effects, and other factors. The most practical way of determining an end-use temperature range is testing in the actual application conditions. Consult a Marco Engineer for more details.


Chemraz® Compound Comparison

Compound #
Handling, Cleaning, Packaging, Designator Options
Compound Type
Color
Service Temp Range (C)
Specific Gravity
Hardness (Shore A)
Compression Set (%)
Tensile Strength (kPa)
Elongation %
Modulus 50% Elongation PSI (kPa)
Modulus 100% Elongation PSI (kPa)
Chemraz 513
SC SS
Perfluoro
White
-30 to 210
2.22
80
25
1660 (11032)
165
540 (3723)
1050 (7239)
Chemraz 520
SC SS
Perfluoro
White
-30 to 240
2.1
90
35
1950 (13445)
110
990 (6826)
1780 (12273)
Chemraz 550
SD
Perfluoro
Black
-30 to 210
1.93
75
25
1750 (12066)
140
450 (3103)
1150 (7929)
Chemraz 570
SD
Perfluoro
White
-30 to 210
1.98
70
35
1300 (8963)
145
350 (2413)
780 (5378)
Chemraz 571
SD
Perfluoro
White
-30 to 210
1.99
80
35
1550 (10687)
130
625 (4309)
1240 (8549)
Chemraz 592
SS
Perfluoro
White
-30 to 240
2.07
85
36
2100 (14479)
120
700 (4826)
1770 (12204)
Chemraz 653
SD
Perfluoro
Black
-15 to 325
1.99
80
14 26**
1830 (12618)
135
360 (2482)
1090 (7516)
Chemraz E38
SS
Perfluoro
White
-20 to 260
1.99
80
21
2200 (15169)
150
410 (2827)
1100 (7585)
Chemraz HT300
SC
Perfluoro
White
-20 to 300
2.14
85
17
2100 (14480)
175
600 (4137)
1100 (7585)
Chemraz 661
SS
Perfluoro
White
-20 to 240
2.11
80
17
2620 (18065)
140
400 (2758)
1200 (8274)
Fluoro- elastomer 742
SP
Fluorocarbon
Black
-30 to 250
1.82
75
20
2050 (14134)
182
600 (4137)
1026 (7074)
Fluoro- elastomer 931
SP
Fluorocarbon
Black
-30 to 250
1.81
90
27
2245 (15479)
107
936 (6453)
1950 (13445)
Fluoraz 888
SP
FEPM Fluoro elastomer
Tan
0 to 230
1.56
70
48
3320 (22892)
325
190 (1310)
455 (3137)

* 70 hours @ 204ºC @ 25% deflection

** 70 hours @ 288ºC @ 25% deflection

Product Handling, Cleaning and Packaging Designators

The handling, cleaning and packaging of elastomeric seals, for use in semiconductor equipment, can be as critical to the performance of the seal as the seal material. One of the following designators is included in each Greene, Tweed part number.

SD Semiconductor grade product with special handling using gloves during processing. Product is washed with deionized water (DI) and inspected to semiconductor standards. Class 100 packaging in double plastic bags.

SS Semiconductor grade product with special handling using gloves during processing. Product is washed with a solvent mixture (50/50 isopropyl alcohol and heptane) and inspected to semiconductor standards. Class 100 packaging in double plastic bags.

SP Industrial grade product without special handling during processing. Product is washed with isopropyl alcohol and is inspected to industrial standards. Standard packaging in single plastic bags.

SC Semiconductor grade product with special handling using gloves during processing. Product is inspected to semiconductor standards. Standard packaging in single plastic bags.