Kalrez® Semiconductor O-Ring
Compound Selection Guide

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Kalrez O-ring FFKM Comparison

  Process Type Typical Seal Temperature Typical Process Environment Suggested Products* Comments Typical Applications
Plasma Processes PECVD
ALD
25 - 200°C TMS, DEMS, TEOS,
SiH4, C3H6, NH3, SiF4,
O2, N2O, NF3
9100
9500

9100 - Low erosion rate and ultra-low particle generation in harsh plasma environments

9500 - Excellent resistance to ozone, ammonia, water vapor and plasma radicals

9300 - Specifically designed for processes where the plasma environment is a combination of ions (“physical”) and radicals (“chemical”)

Dynamic:

  • Door seals
  • Gate valves
  • Pendulum valves

Static:

  • Chamber lid seals
  • Exhaust valves
  • Gas inlet/outlet/mixing block seals
  • Window seals
  • Center rings

Carrier:

  • Wafer/FPD Support/Transport
HDPCVD 25 - 200°C TEOS, SiH4,
NH3, SiF4, O2, C2F6,
N2O, NF3, CF4
9100
9500
SACVD 25 - 200°C TEP, TEBO, TEOS,
O3, NF3
9500
8085
Ash/Strip 25 - 200°C O2, CF4, CHF3,
NH3, H2O
Vapor Forming Gas
9500
8002
Dielectric (Oxide) Etch 25 - 200°C CF4, C3F8, CHF3,
SF6, O2, H2
9300
9500
Conductor (Poly/Metal) Etch 25 - 200°C CF4, CHF3, HBr,
BCl3, CCl4, Cl2
9500
9100
Thermal Processes Metal CVD
ALD
LPCVD
25 - 300°C Organic precursors,
WF6, TiCl4, SiH4, HF,
F2, Cl2, ClF3, NF3,
H2O Vapor, O2, O3
8900
9100

8900 - Suggested product for metal CVD, ALD, LPCVD, oxidation and diffusion processes.

8475 - Suggested product for lamp anneal and RTP processes.

  • Quartz chamber seal
  • Fittings
  • Center ring
  • Plenum seals
Oxidation
Diffusion
25 - 300°C N2, O2, H2O,
HCl, Cl2
8900
8475
Lamp Anneal RTP 150 - 300°C Resistance to
IR absorption
8475
Wet Processes Water Prep 25 - 125°C UPDI, Piranha
SC-1, SC-2, O3
HF (49%)
6375UP

6375UP - General purpose product for all wet process applications.

  • Door/lid seals
  • Drain seals
  • Seals for chemical containers
  • Fittings
  • Seals for filters/ connectors
  • Flow meters
Etching 25 - 180°C HNO3, HF, H2O,
H3PO4, HNO3
Acetic/H2O
Photolithography 25 - 125°C H2SO4 + Oxidant
Organic Acids, nMP
Stripping 25 - 125°C nMP/Alkanolamine
Hydroxlamine
6375UP
1050LF
Copper Plating 25 - 100°C CuSO4 Solution
H2SO4, H2O2
6375UP

Suggested Products for Semiconductor Use

DuPont™ Kalrez® 9100 is an amber translucent product targeted specifically for HDPCVD and PECVD processes. It has also exhibited excellent performance in “select” etch process applications. Kalrez® 9100 has been specifically designed for low erosion and ultra-low particle generation in harsh plasma environments. It offers excellent thermal stability, very low outgassing as well as excellent elastic recovery and good mechanical strength properties and is well suited for both static and “select” dynamic sealing applications. A maximum application temperature of 300 °C is suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez® 9100 parts.

DuPont™ Kalrez® 9300 is a brown product for Dielectric (Oxide) Etch processes. It has been specifically designed for use in applications where the plasma environment is a combination of ions (“physical”) and radicals (“chemical”), i.e., where a balance of “physical” and “chemical” plasma erosion resistance is typically required. Kalrez® 9300 exhibits excellent resistance to oxygen and fluorine-based plasma and etch process chemistry. It also offers very low metals content, excellent thermal stability and mechanical strength and is well suited for both static and dynamic sealing applications. A maximum application temperature of 300 °C is suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez® 9300 parts.

DuPont™ Kalrez® 9500 is a tan product for Deposition, Ash/Strip and Conductor (Poly/Metal) Etch processes. It has been specifically designed for use in applications where ozone is used for processing, e.g. SACVD, PECVD ultra-low K (BLOK™) and where the plasma environment is more “chemical”, i.e., where oxygen and fluorine radicals are more dominant. Kalrez® 9500 exhibits excellent resistance to CVD and ash/strip process chemistry, i.e., ozone, ammonia and water vapor. It also offers outstanding thermal stability, very low outgassing and excellent mechanical strength and is well suited for both static and dynamic sealing applications. A maximum application temperature of 310 °C is suggested. Kalrez® 9500 can also withstand short term excursions up to 325 °C. Ultrapure post-cleaning and packaging is standard for all Kalrez® 9500 parts.

DuPont™ Kalrez® 8900 is a black product for all thermal processes, e.g., oxidation, diffusion furnace, metal CVD, ALD and LPCVD. It offers outstanding thermal stability, very low outgassing and excellent (low) compression set properties. Kalrez® 8900 exhibits excellent retention of physical properties at elevated temperatures, has excellent mechanical strength and is well-suited for both static and dynamic sealing applications. A maximum application temperature of 325 °C is suggested. Short excursions to higher temperatures may also be possible. Ultrapure post-cleaning and packaging is standard for all Kalrez® 8900 parts.

DuPont™ Kalrez® 8475 has been specifically developed to meet the challenging requirements associated with lamp anneal and RTP sealing applications in semiconductor thermal processes. It exhibits excellent thermal stability and long-term sealing performance and has less IR absorption significantly reduced outgassing properties at elevated temperatures. Kalrez® 8475 has good mechanical properties and is well-suited for static and low stress/low sealing force applications (e.g., quartz tube seals, ball joint seals, bell jar seals, plenum seals). A maximum application temperature of 300 °C is suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez® 8475 parts.

DuPont™ Kalrez® 6375UP is a general purpose black product for all wet process applications. This product exhibits excellent chemical resistance to all different types of wet process chemicals including acids, bases and amine-base strippers. It features low elemental extractables with good mechanical and compression set properties and is well-suited for both static and dynamic wet process seal applications (e.g., filter seals, drain seals and flow meters). A maximum application temperature of 275 °C is suggested. Ultrapure post-cleaning and packaging is standard for Kalrez® 6375UP parts.

Additional Products Available

DuPont™ Kalrez® 8002 is a clear product for ash/strip and “select” etch and deposition processes. This unfilled product offers excellent plasma cracking resistance and ultra-low particle generation in oxygen and fluorine-based plasmas versus mineral-filled products. Kalrez® 8002 exhibits excellent resistance to dry process chemistry has good mechanical strength and is well suited for static, low stress/low sealing force and “select” bonded door seal applications. A maximum application temperature of 275 °C is suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez® 8002 parts.

DuPont™ Kalrez® 8085 is a beige, general purpose product for “select” etch, ash/strip and deposition processes, e.g., HDPCVD, PECVD and SACVD. It has been formulated for minimal particle generation in NF3 plasma. Kalrez® 8085 exhibits very low particle generation and low weight loss in oxygen and fluorine-based plasma, has excellent mechanical strength and is well-suited for both static and dynamic sealing applications (e.g., bonded slit valve doors, bonded gate valves, bonded pendulum valves, gas orifice seals, gas feed-through seals, chamber lid seals). A maximum application temperature of 240 °C is suggested. Kalrez® 8085 can also withstand short-term excursions to 275 °C. Ultrapure post-cleaning and packaging is standard for all Kalrez® 8085 parts.

DuPont™ Kalrez® 1050LF is a black product targeted specifically for semiconductor wet process applications where high concentrations of certain amines are present. It exhibits excellent amine resistance and has excellent thermal stability and mechanical strength properties. Kalrez® 1050LF is not recommended for use in organic or inorganic acids at elevated temperatures. A maximum application temperature of 288 °C is suggested. Ultrapure post-cleaning and packaging is available. Please order this product as 1050UP when specifying ultrapure post-cleaning and packaging.

Semiconductor Product Information1

PRoduct Color Hardness
Shore A
(pellet)2
Hardness
Shore M
(O-ring)4
Maximum
Application TemP9 °C
100%
Modulus5
MPa
Compression Set8
at 70 hr, 204°C
9100 Amber translucent 6810 74 300 4.76 18
9300 Brown 7410 78 300 6.66 20
9500 Tan 7510 79 310 9.50 20
8002 Clear 693 76 275 2.888 15
8085 Beige 80 86 240 7.50 42
8900 Black 73 82 325 12.21 9
8475 White 60 71 300 2.20 23
6375UP Black 75 83 275 7.23 257
1050LF Black 82 - 288 12.40 357

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