Kalrez® Semiconductor O-Ring
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Kalrez O-ring FFKM Comparison
Process Type | Typical Seal Temperature | Typical Process Environment | Suggested Products* | Comments | Typical Applications | |
---|---|---|---|---|---|---|
Plasma Processes | PECVD ALD | 25 - 200°C | TMS, DEMS, TEOS, SiH 4 , C 3 H 6 , NH 3 , SiF 4 , O 2 , N 2 O, NF 3 | K9100 K9500 | K9100 - Low erosion rate and ultra-low particle generation in harsh plasma environments K9500 - Excellent resistance to ozone, ammonia, water vapor and plasma radicals K9300 - Specifically designed for processes where the plasma environment is a combination of ions (“physical”) and radicals (“chemical”) | Dynamic:
Static:
Carrier:
|
HDPCVD | 25 - 200°C | TEOS, SiH 4 , NH 3 , SiF 4 , O 2 , C 2 F 6 , N 2 O, NF 3 , CF 4 | K9100 K9500 | |||
SACVD | 25 - 200°C | TEP, TEBO, TEOS, O 3 , NF 3 | K9500 K8085 | |||
Ash/Strip | 25 - 200°C | O 2 , CF 4 , CHF 3 , NH 3 , H 2 O Vapor Forming Gas | K9500 K8002 | |||
Dielectric (Oxide) Etch | 25 - 200°C | CF 4 , C 3 F 8 , CHF 3 , SF 6 , O 2 , H 2 | K9300 9500 | |||
Conductor (Poly/Metal) Etch | 25 - 200°C | CF 4 , CHF 3 , HBr, BCl 3 , CCl 4 , Cl 2 | K9500 K9100 | |||
Thermal Processes | Metal CVD ALD LPCVD | 25 - 300°C | Organic precursors, WF 6 , TiCl 4 , SiH 4 , HF, F 2 , Cl 2 , ClF 3 , NF 3 , H 2 O Vapor, O 2 , O 3 | K8900 K9100 | K8900 - Suggested product for metal CVD, ALD, LPCVD, oxidation and diffusion processes. K8475 - Suggested product for lamp anneal and RTP processes. |
|
Oxidation Diffusion | 25 - 300°C | N 2 , O 2 , H 2 O, HCl, Cl 2 | K8900 K8475 | |||
Lamp Anneal RTP | 150 - 300°C | Resistance to IR absorption | K8475 | |||
Wet Processes | Water Prep | 25 - 125°C | UPDI, Piranha SC-1, SC-2, O 3 HF (49%) | K6375UP | K6375UP - General purpose product for all wet process applications. |
|
Etching | 25 - 180°C | HNO 3 , HF, H 2 O, H 3 PO 4 , HNO 3 Acetic/H 2 O | ||||
Photolithography | 25 - 125°C | H 2 SO 4 + Oxidant Organic Acids, nMP | ||||
Stripping | 25 - 125°C | nMP/Alkanolamine Hydroxlamine | 6375UP K1050LF | |||
Copper Plating | 25 - 100°C | CuSO 4 Solution H 2 SO 4 , H 2 O 2 | K6375UP |
Suggested Products for Semiconductor Use
DuPont™ Kalrez® 9100 is an amber translucent product targeted specifically for HDPCVD and PECVD processes. It has also exhibited excellent performance in “select” etch process applications. Kalrez® 9100 has been specifically designed for low erosion and ultra-low particle generation in harsh plasma environments. It offers excellent thermal stability, very low outgassing as well as excellent elastic recovery and good mechanical strength properties and is well suited for both static and “select” dynamic sealing applications. A maximum application temperature of 300 °C is suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez® 9100 parts.
DuPont™ Kalrez® 9300 is a brown product for Dielectric (Oxide) Etch processes. It has been specifically designed for use in applications where the plasma environment is a combination of ions (“physical”) and radicals (“chemical”), i.e., where a balance of “physical” and “chemical” plasma erosion resistance is typically required. Kalrez® 9300 exhibits excellent resistance to oxygen and fluorine-based plasma and etch process chemistry. It also offers very low metals content, excellent thermal stability and mechanical strength and is well suited for both static and dynamic sealing applications. A maximum application temperature of 300 °C is suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez® 9300 parts.
DuPont™ Kalrez® 9500 is a tan product for Deposition, Ash/Strip and Conductor (Poly/Metal) Etch processes. It has been specifically designed for use in applications where ozone is used for processing, e.g. SACVD, PECVD ultra-low K (BLOK™) and where the plasma environment is more “chemical”, i.e., where oxygen and fluorine radicals are more dominant. Kalrez® 9500 exhibits excellent resistance to CVD and ash/strip process chemistry, i.e., ozone, ammonia and water vapor. It also offers outstanding thermal stability, very low outgassing and excellent mechanical strength and is well suited for both static and dynamic sealing applications. A maximum application temperature of 310 °C is suggested. Kalrez® 9500 can also withstand short term excursions up to 325 °C. Ultrapure post-cleaning and packaging is standard for all Kalrez® 9500 parts.
DuPont™ Kalrez® 8900 is a black product for all thermal processes, e.g., oxidation, diffusion furnace, metal CVD, ALD and LPCVD. It offers outstanding thermal stability, very low outgassing and excellent (low) compression set properties. Kalrez® 8900 exhibits excellent retention of physical properties at elevated temperatures, has excellent mechanical strength and is well-suited for both static and dynamic sealing applications. A maximum application temperature of 325 °C is suggested. Short excursions to higher temperatures may also be possible. Ultrapure post-cleaning and packaging is standard for all Kalrez® 8900 parts.
DuPont™ Kalrez® 8475 has been specifically developed to meet the challenging requirements associated with lamp anneal and RTP sealing applications in semiconductor thermal processes. It exhibits excellent thermal stability and long-term sealing performance and has less IR absorption significantly reduced outgassing properties at elevated temperatures. Kalrez® 8475 has good mechanical properties and is well-suited for static and low stress/low sealing force applications (e.g., quartz tube seals, ball joint seals, bell jar seals, plenum seals). A maximum application temperature of 300 °C is suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez® 8475 parts.
DuPont™ Kalrez® 6375UP is a general purpose black product for all wet process applications. This product exhibits excellent chemical resistance to all different types of wet process chemicals including acids, bases and amine-base strippers. It features low elemental extractables with good mechanical and compression set properties and is well-suited for both static and dynamic wet process seal applications (e.g., filter seals, drain seals and flow meters). A maximum application temperature of 275 °C is suggested. Ultrapure post-cleaning and packaging is standard for Kalrez® 6375UP parts.
Additional Products Available
DuPont™ Kalrez® 8002 is a clear product for ash/strip and “select” etch and deposition processes. This unfilled product offers excellent plasma cracking resistance and ultra-low particle generation in oxygen and fluorine-based plasmas versus mineral-filled products. Kalrez® 8002 exhibits excellent resistance to dry process chemistry has good mechanical strength and is well suited for static, low stress/low sealing force and “select” bonded door seal applications. A maximum application temperature of 275 °C is suggested. Ultrapure post-cleaning and packaging is standard for all Kalrez® 8002 parts.
DuPont™ Kalrez® 8085 is a beige, general purpose product for “select” etch, ash/strip and deposition processes, e.g., HDPCVD, PECVD and SACVD. It has been formulated for minimal particle generation in NF3 plasma. Kalrez® 8085 exhibits very low particle generation and low weight loss in oxygen and fluorine-based plasma, has excellent mechanical strength and is well-suited for both static and dynamic sealing applications (e.g., bonded slit valve doors, bonded gate valves, bonded pendulum valves, gas orifice seals, gas feed-through seals, chamber lid seals). A maximum application temperature of 240 °C is suggested. Kalrez® 8085 can also withstand short-term excursions to 275 °C. Ultrapure post-cleaning and packaging is standard for all Kalrez® 8085 parts.
DuPont™ Kalrez® 1050LF is a black product targeted specifically for semiconductor wet process applications where high concentrations of certain amines are present. It exhibits excellent amine resistance and has excellent thermal stability and mechanical strength properties. Kalrez® 1050LF is not recommended for use in organic or inorganic acids at elevated temperatures. A maximum application temperature of 288 °C is suggested. Ultrapure post-cleaning and packaging is available. Please order this product as 1050UP when specifying ultrapure post-cleaning and packaging.
Semiconductor Product Information 1
PRoduct | Color | Hardness Shore A (pellet) 2 | Hardness Shore M (O-ring) 4 | Maximum Application TemP 9 °C | 100% Modulus 5 MPa | Compression Set 8 at 70 hr, 204°C |
---|---|---|---|---|---|---|
9100 | Amber translucent | 68 10 | 74 | 300 | 4.76 | 18 |
9300 | Brown | 74 10 | 78 | 300 | 6.66 | 20 |
9500 | Tan | 75 10 | 79 | 310 | 9.50 | 20 |
8002 | Clear | 69 3 | 76 | 275 | 2.88 8 | 15 |
8085 | Beige | 80 | 86 | 240 | 7.50 | 42 |
8900 | Black | 73 | 82 | 325 | 12.21 | 9 |
8475 | White | 60 | 71 | 300 | 2.20 | 23 |
6375UP | Black | 75 | 83 | 275 | 7.23 | 25 7 |
1050LF | Black | 82 | - | 288 | 12.40 | 35 7 |
- 1 Not to be used for specification purposes
- 2 ASTM D2240 (pellet test specimens unless otherwise noted)
- 3 JIS 6253 (plied slab test specimens)
- 4 ASTM D2240 and ASTM D1414 (AS568 K214 O-ring test specimens)
- 5 ASTM D412 (dumbbell test specimens unless otherwise noted)
- 6 JIS 6251 (dumbbell test specimens)
- 7 ASTM D395B (pellet test specimens)
- 8 ASTM D395B and ASTM D1414 (AS568 K214 O-ring test specimens unless otherwise noted)
- 9 DuPont proprietary test method
- 10 ASTM D2240 (plied slab test specimens)