Chemraz® Semiconductor Process
O-Ring and Seal&nsp;Compound Selection Guide

Contact a Semiconductor Application Engineer

 

Compound
Name
Features and Benefits Service Temp Range (C) Wet vs.
Dry
Static vs. 
Dynamic
Primary Choices for Processes (Bold) Applications
Chemraz 513 Good plasma resistance

Good physical properties

Minimal contamination

Excellent performance history as "universal product"

-30 to 210ºC

Dry Static

Metalization (CVD, PVD, sputtering, evaporation)
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Dry Ashing

Ion Implant
Implant Anneal
RTP

Door Seals, Slit Valves, Window Seals, Isolator Valve Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals

Chemraz 520 Excellent plasma resistance

Outstanding physical properties

Low contaminants

Withstands higher sealing loads

Excellent performance history in higher temperature applications

-30 to 240ºC Dry Static
and
Dynamic

Metalization (CVD, PVD, sputtering, evaporation)
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Dry Ashing

Oxidation (LPCVD)
Diffusion
Ion Implant
Implant Anneal
RTP

Door Seals, Slit Valves, Window Seals, Isolator Valve Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals

Chemraz 550 Good chemical resistance

Good physical properties

Used where contamination requirements are less critical

Excellent performance history

-30 to 210ºC Wet Static
and
Dynamic
Wet Etch (acid, base)
Wet Stripping (solvents)
Wet Cleaning (UPDI)
Wet Metal Plating
Valve Seals, Fitting and Union Seals, Gaskets, Regulator Seals, Filter Seals
Chemraz 570
Chemraz 571
Very low contaminants

Extended performance and added reliability

Good physical properties

Excellent performance history in wet systems

-30 to 210ºC Wet Static Wet Etch (acid, base)
Wet Stripping (solvents)
Wet Cleaning (UPDI)

Wet Metal Plating
Chemical Mechanical Planarization (CMP)
Valve Seals, Fitting and Union Seals, Gaskets, Regulator Seals, Filter Seals
Chemraz 592 Excellent physical properties

Inert filler system ensures excellent resistance to plasma attack

-30 to 240ºC Dry Static
and
Dynamic
Dry Ashing (O2)
Oxidation (LPCVD)
Diffusion
Metalization (CVD, PVD, sputtering, evaporation)
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Ion Implant
Implant Anneal
RTP
Slit Valves, Endpoint Windows, Window Seals, Valve Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals, Isolator Valve Seals, Bell Jar Seals
Chemraz 653

Excellent plasma resistance

Used where contamination requirements are less critical

Suitable for higher temperature applications

Superior compression set

-15 to 325ºC Dry Static
and
Dynamic
Oxidation (LPCVD)
Diffusion
RTP

Metalization (CVD, PVD, sputtering, evaporation)
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Dry Ashing
Implant Anneal
Quartz Rod Seals, Bell Jar Seals, High Temperature Valve Seals, KF Fitting Seals
Chemraz E38 Minimal contamination

Withstands a variety of aggressive chemicals

Excellent physical properties

Low metal ion content

Unlimited design flexibility

Suitable for higher temperature applications

-20 to 260ºC Dry Static
and
Dynamic
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Remote Plasma Cleans
Oxidation (LPCVD)
Diffusion
Metalization (CVD, PVD, sputtering, evaporation)
Dry Plasma Etch
Dry Ashing
Ion Implant
Implant Anneal
RTP
Bonded Gate Seals, Chamber Seals
Chemraz 661 Minimal particulation

Maximum plasma resistance

Withstands a variety of aggressive chemicals

Excellent physical properties

Unique filler system

-20 to 240ºC Dry Static
and
Dynamic
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Dry Ashing
Oxidation (LPCVD)
Diffusion
Metalization (CVD, PVD, sputtering, evaporation)
Ion Implant
Implant Anneal
RTP
Endpoint Windows, Bell Jar Seals, Valve Seals, KF Fitting Seals, Window Seals, Isolator Valve Seals, Lid Seals, Gas Inlet Seals, Slit Valve Seals, Chamber Seals
Fluoro-
elastomer 742
Outstanding physical properties

Conforms well to handware features

Used where contamination requirements are less critical

Good performance history in chemically aggressive systems

-30 to 250ºC Dry
and
Wet
Static
and
Dynamic
Metalization (CVD, PVD, sputtering, evaporation)
Ion Implant
Oxidation (LPCVD)
Diffusion
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Dry Ashing
Wet Etch (acid, base)
Wet Cleaning (UPDI)
Wet Metal Plating
Implant Anneal
RTP
Door Seals, Slit Valves, Window Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals, Valve Seals, Gaskets, Fitting and Union Seals
Fluoro-
elastomer 931
Outstanding physical properties

Used where contamination requirements are less critical

Superior performance under higher sealing loads

Good performance history in chemically aggressive systems

-30 to 250ºC Dry
and
Wet
Static
and
Dynamic
Ion Implant
Oxidation (LPCVD)
Diffusion
Metalization (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Dry Plasma Etch
Remote Plasma Cleans
Dry Ashing
Wet Etch (acid, base)
Wet Cleaning (UPDI)
Wet Metal Plating
Implant Anneal
RTP
Door Seals, Slit Valves, Window Seals, Lid Seals, Gas Inlet Seals, KF Fitting Seals, Valve Seals, Gaskets, Fitting and Union Seals
Fluoraz 888 Outstanding physical properties

Good performance history in aggressive chemicals

Conforms well to hardware features

0 to 230ºC Dry
and
Wet
Static
and
Dynamic
Metalization (CVD, PVD, sputtering, evaporation)
Dry Plasma Etch
Ion Implant
Oxidation (LPCVD)
Diffusion
Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
Remote Plasma Cleans
Dry Ashing
Implant Anneal
RTP
Valve Seals, KF Fitting Seals, Window Seals, Lid Seals, Gas Inlet Seals, Chamber Seals, Door Seals, Gaskets, Fitting and Union Seals, Slit Valves


 

Chemraz Compound Property Comparison

Contact a Semiconductor Application Engineer

Compound Name Handling, Cleaning, Packaging, Designator Options Compound Type Compound Color Service Temp Range (C) Specific Gravity Hardness (Shore A) Compression Set (%)* Tensile Strength psi (kPa) Elongation (%) Modulus 50% Elongation psi (kPa) Modulus 100% Elongation psi (kPa)
Chemraz 513 SC
SS
Perfluoro White -30 to 210 2.22 80 25 1660
(11032)
165 540
(3723)
1050
(7239)
Chemraz
520
SC
SS
Perfluoro White -30 to 240 2.10 90 35 1950
(13445)
110 990
(6826)
1780
(12273)
Chemraz
550
SD Perfluoro Black -30 to 210 1.93 75 25 1750
(12066)
140 450
(3103)
1150
(7929)
Chemraz
570
SD Perfluoro White -30 to 210 1.98 70 35 1300
(8963)
145 350
(2413)
780
(5378)
Chemraz
571
SD Perfluoro White -30 to 210 1.99 80 35 1550
(10687)
130 625
(4309)
1240
(8549)
Chemraz
592
SS Perfluoro White -30 to 240 2.07 85 36 2100
(14479)
120 700
(4826)
1770
(12204)
Chemraz
653
SD Perfluoro Black -15 to 325 1.99 80 14
26**
1830
(12618)
135 360
(2482)
1090
(7516)
Chemraz
E38
SS Perfluoro White -20 to 260 1.99 80 21 2200
(15169)
150 410
(2827)
1100
(7585)
Chemraz 
HT300
SC Perfluoro White -20 to 300 2.14 85 17 2100
(14480)
175 600
(4137)
1100
(7585)
Chemraz 
661
SS Perfluoro White -20 to 240 2.11 80 17 2620
(18065)
140 400
(2758)
1200
(8274)
Fluoro-
elastomer 742
SP Fluorocarbon Black -30 to 250 1.82 75 20 2050
(14134)
182 600
(4137)
1026
(7074)
Fluoro-
elastomer
931
SP Fluorocarbon Black -30 to 250 1.81 90 27 2245
(15479)
107 936
(6453)
1950
(13445)
Fluoraz 888 SP FEPM
Fluoro
elastomer
Tan 0 to 
230
1.56 70 48 3320
(22892)
325 190
(1310)
455
(3137)

* 70 hours @ 204ºC @ 25% deflection
** 70 hours @ 288ºC @ 25% deflection

 

Product Handling, Cleaning and Packaging Designators

The handling, cleaning and packaging of elastomeric seals, for use in semiconductor equipment, can be as critical to the performance of the seal as the seal material. One of the following designators is included in each Greene, Tweed part number.

SD — Semiconductor grade product with special handling using gloves during processing. Product is washed with deionized water (DI) and inspected to semiconductor standards. Class 100 packaging in double plastic bags.

SS — Semiconductor grade product with special handling using gloves during processing. Product is washed with a solvent mixture (50/50 isopropyl alcohol and heptane) and inspected to semiconductor standards. Class 100 packaging in double plastic bags.

SP — Industrial grade product without special handling during processing. Product is washed with isopropyl alcohol and is inspected to industrial standards. Standard packaging in single plastic bags.

SC — Semiconductor grade product with special handling using gloves during processing. Product is inspected to semiconductor standards. Standard packaging in single plastic bags.

Statements and recommendations in this publication are based on our experience and knowledge of typical applications of this product and shall not constitute a guarantee of performance nor a modification or alteration of our standard warranty which shall be applicable to such products.

Prior to actual use it is recommended compatibility tests be run to determine suitability in a specific application. This is critical where failure could result in injury or damage. A regular program of inspection and replacement should be implemented. Greene, Tweed technical personnel are available to help with a recommendation.

Contact a Semiconductor Application Engineer



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